The TSP 510 3M is a telecommunications splice connector used to join and insulate copper communication wires quickly and reliably. It is designed for low-voltage telephone and data cable applications and is supplied in a carton of 200 pieces.
Model: TSP 510 (3M type)
Packing: 200 pcs/ctn
IDC (Insulation Displacement) connection – no wire stripping required
Gel-filled design for moisture protection
Provides secure and low-resistance wire splicing
Quick and easy installation
Corrosion-resistant and durable
Suitable for telephone, telecom, alarm, and low-voltage communication systems
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