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  • Model: TSP 510 (3M type)

  • Packing: 200 pcs/ctn

  • IDC (Insulation Displacement) connection – no wire stripping required

  • Gel-filled design for moisture protection

  • Provides secure and low-resistance wire splicing

  • Quick and easy installation

  • Corrosion-resistant and durable

  • Suitable for telephone, telecom, alarm, and low-voltage communication systems

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